产品简介 Produsts Introduction
本机型为626969con澳门玄机专门为切割半导体硅片设计的一款机型,应用金刚石线切割,大切割幅面为Φ300mm
(12 英寸)。该设备具有精密温度控制系统,切片精度高,翘曲度小,切片质量稳定,切割成本低。
This series is specially designed for cutting semiconductor silicon wafers. The maximum cutting width is Φ300 mm (12 inches) with diamond wire cutting. It has a precise temperature
control system, high slice precision, small warpage, stable slice quality and low cutting cost.
切割样品 Cutting sample
机型特点Characteristics
技术参数 Parameter
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